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Introduction
Amkor MEMS & Sensor Packaging Solutions
Amkor is the world's leader in microelectronic packaging technologies and the worlds largest outsource provider of MEMS and Sensors. Amkor is the world's leading service provider in MEMS packaging technology and offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications.
Flip Chip CSP Packaging Solutions
Amkor Technology offers the fcCSP package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect. Current wafer bump technology and flip chip assembly process allows for peripheral flip chip bumping or area array bumping, with either solder or Copper Pillar (CuP) Bump Technology. The fcCSP is also available in LGA format, allowing for a lower minimum package thickness.
Amkor is the world's leader in microelectronic packaging technologies and the worlds largest outsource provider of MEMS and Sensors. Amkor is the world's leading service provider in MEMS packaging technology and offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications.
Flip Chip CSP Packaging Solutions
Amkor Technology offers the fcCSP package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect. Current wafer bump technology and flip chip assembly process allows for peripheral flip chip bumping or area array bumping, with either solder or Copper Pillar (CuP) Bump Technology. The fcCSP is also available in LGA format, allowing for a lower minimum package thickness.
Contact Info
Address:
Amkor Technology - 1900 South Price Road, Chandler AZ USA 85286
new york
USA 47868
United States
new york
USA 47868
United States
Tel:
(480) 821-5000
Fax:
(480) 821-5000
Website:
http://www.amkor.com/
Offering
- electric bulbs
Hours of operation
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